Preparation method of nickel target
Preparation method of nickel target
Sputtering method: includes DC sputtering and RF sputtering. DC sputtering is used for non-insulating materials such as nickel. A voltage difference is formed between the target and the substrate through a DC power supply to drive nickel atoms to sputter from the target surface to the substrate. RF sputtering is suitable for insulating or high-resistance materials. By forming an RF electric field between the target and the substrate, the gas is excited to generate plasma, thereby promoting the deposition of nickel atoms.
Electron beam evaporation method: In a vacuum environment, a high-energy electron beam is used to hit the nickel target, so that the nickel atoms on its surface gain energy and evaporate, and condense on the substrate to form a thin film.
Chemical vapor deposition (CVD): Nickel is deposited on the substrate surface at high temperature by chemical reaction. This method requires volatile compounds of nickel as reactants. By precisely controlling the reaction conditions, a high-purity and uniform nickel film can be obtained.
Hot pressing method: Nickel powder is compressed and molded under high temperature and high pressure, which is usually used to produce high-purity and high-density nickel targets. This method can control the microstructure of the nickel target.
Nickel target product detailed parameter table
|
Product name |
Factory Supply High Quality Nickel Sputtering Target for Pvc Coating |
|
Grade |
Ni200(N6), Ni201(N4) |
|
Origin |
baoji city Shaanxi Province china |
|
shape |
Round target / plate target / tube target |
|
Nickel content |
99.6%, 99.9% |
|
Impurity content |
<0.01 (%) |
|
Surface |
Hot rolled/cold rolled |
|
Standard |
ASTM B127/ASTM B162 |
|
Technique |
Forged and CNC Machined |
|
Application |
pvd coating industry |
Nickel Sputtering Target Product Display
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