Tantalum crucibles with 99.9% purity and outer diameter 10 mm are compact, robust vessels designed for small‑scale industrial melting, sampling, or handling of reactive metals where space constraints and precise dosing matter.
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Description
Technical Parameters
Defining High Purity in Tantalum Crucibles
A Tantalum Crucible High Purity is manufactured from refined tantalum with impurity levels minimized to parts-per-million, delivering contamination-free containment for industrial processes where material integrity determines performance and yield.
High purity typically starts at 99.95% tantalum, with premium grades reaching 99.99% or higher. Impurity control focuses on restricting Fe, Ni, Cr, O, N, and C to very low ppm values via triple-melt processes (Vacuum Arc Remelting + Electron Beam Melting + Zone Refining). This ensures the crucible will not introduce foreign elements into molten metals, specialty alloys, or ceramics during high-temperature processing.
Impurity
Typical Max (ppm) – 99.99% Grade
Effect if Exceeded
Fe
≤ 5
Alters alloy chemistry, causes inclusions
Ni
≤ 3
Reduces corrosion resistance of melt
O
≤ 5
Induces high‑temp brittleness
C
≤ 10
Forms carbides, weakens structure
Industrial Applications Leveraging High Purity
Rare Earth & Strategic Metals – Electrolytic reduction of neodymium or dysprosium in fluoride melts; purity prevents magnetic property degradation.Semiconductor Targets – Melting high-purity metals (e.g., molybdenum, tungsten) for sputtering; no dopant contamination.Nuclear Fuel Fabrication – Containing molten actinide alloys without adding neutron absorbers.
High purity crucibles maintain structural stability at >2400 °C in inert atmospheres, with negligible vapor pressure, ensuring consistent chemistry across large batches.
Operational Advantages
Ultra-low outgassing (<10⁻⁹ Torr·L/s·cm²) supports ultra-high-vacuum processes. Fine, recrystallized grain structure enhances creep resistance, allowing loads of 10 MPa at 2000 °C. Smooth surface finish (Ra ≤ 0.4 µm) aids cleaning and prevents melt adhesion, making them ideal for automated high-throughput lines in aerospace alloy and electronics material plants.
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