Pure Tantalum Plate/sheet/strip/foil
|
Thickness |
Permissible thickness deviation |
Permissible thickness deviation |
Width |
Permissible width deviation |
Length |
Allowable length deviation |
|
0.025~0.07 |
±0.005 |
±0.006 |
70~150 |
±2.0 |
≥1000 |
- |
|
>0.07~0.09 |
±0.006 |
±0.008 |
70~150 |
±2.0 |
≥1000 |
- |
|
0.1~0.20 |
±0.015 |
±0.02 |
50~300 |
±2.0 |
100~2000 |
±3.0 |
|
>0.2~0.30 |
±0.02 |
±0.03 |
50~300 |
±2.0 |
100~2000 |
±3.0 |
|
>0.30~0.50 |
±0.03 |
±0.04 |
50~500 |
±2.0 |
100~2000 |
±3.0 |
|
>0.50~0.80 |
±0.04 |
±0.06 |
50~500 |
±2.0 |
50~1200 |
±3.0 |
|
>0.80~1.0 |
±0.06 |
±0.08 |
50~500 |
±2.0 |
50~1200 |
±3.0 |
|
>1.0~1.5 |
±0.08 |
±0.10 |
50~500 |
±3.0 |
50~1200 |
±4.0 |
|
>1.5~2.0 |
±0.12 |
±0.14 |
50~500 |
±3.0 |
50~1200 |
±4.0 |
|
>2.0~3.0 |
±0.16 |
±0.18 |
50~500 |
±5.0 |
50~1200 |
±5.0 |
|
>3.0~4.0 |
±0.18 |
±0.20 |
50~500 |
±5.0 |
50~1200 |
±5.0 |
|
>4.0~6.0 |
±0.12 |
±0.24 |
50~500 |
±5.0 |
50~1200 |
±5.0 |
|
>6.0~30.0 |
±0.24 |
±0.50 |
50~500 |
±5 |
50~1200 |
±5.0 |
Ta Sheet: Redefining "Thin" with Purpose
While Ta plate excels in brute-force applications, Ta sheet (thin, flexible sheets typically <0.5 mm thick) redefines tantalum's potential in precision engineering. By reducing thickness, manufacturers unlock new properties-flexibility, conformability, and suitability for thin-film deposition-making Ta sheet a critical material in electronics, optics, and medical devices.
Ta sheet is not merely a thinner version of Ta plate; it is engineered for applications requiring formability and surface uniformity. Thicknesses range from 0.01 mm (foil) to 0.5 mm, with tighter tolerances (±0.005 mm) than plate. Its production involves additional rolling passes and stress-relief annealing to prevent cracking, resulting in a material that balances flexibility with mechanical strength.
Flexural Strength: Unlike brittle ceramics, Ta sheet bends without fracturing, making it ideal for curved components like sensor housings or battery casings.
Surface Smoothness: Ta sheet can be polished to a mirror finish (Ra < 0.1 μm), critical for applications requiring uniform surface energy, such as semiconductor wafer handling.
Thermal Conductivity: With a thermal conductivity of ~57 W/m·K (higher than stainless steel), Ta sheet efficiently dissipates heat in compact electronics, preventing overheating.
