Detailed tungsten target preparation methods
1. Powder metallurgy This is the most traditional and commonly used method for preparing tungsten targets. Tungsten powder is first pressed into shape and then sintered at high temperature in a hydrogen atmosphere. This process can produce high-purity, high-density tungsten targets, but its products often require subsequent processing to meet specific size and shape requirements.
2. Sputtering target preparation Sputtering is a method that uses ion bombardment in a vacuum to deposit tungsten material onto a substrate to form a thin film. This method is particularly effective for preparing high-purity, fine-structured tungsten thin film targets. Suitable for applications that require very flat and uniform surfaces, such as semiconductor manufacturing.
3. Hot isostatic pressing technology Hot isostatic pressing (HIP) technology densifies tungsten materials by applying high temperature and high pressure simultaneously. This method can eliminate pores and defects that may be generated during powder metallurgy, thereby producing tungsten targets with higher density and better uniformity.
4. Melting method The tungsten is completely melted at high temperature and then made into a target by casting or other molding processes. Although this method can produce larger tungsten targets, it is difficult to control their purity and microstructure.
5. Chemical Vapor Deposition (CVD) CVD is a method of decomposing a gaseous precursor at high temperature to deposit tungsten on a substrate. This technology is mainly used to prepare thin film materials with specific microstructures and high purity requirements.
Tungsten target basic parameters
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Model Number
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tungsten sputtering target
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Shape
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customized
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Chemical Composition
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Application
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Industry
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Material
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Tungsten
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Product Name
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high purity tungsten and tungsten alloy sputtering target
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Tungsten target picture display
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