How Do Tungsten Targets Work in The Sputtering Process?

Sputtering is a physical vapor deposition (PVD) technique in which ionized gas atoms are accelerated toward a tungsten target. When these energetic ions strike the surface of the tungsten target, tungsten atoms are ejected from the target material. These ejected tungsten atoms then travel through a gas-filled chamber and are deposited on a substrate to form a thin film. The high melting point and good thermal stability of the tungsten target enable it to withstand the bombardment of energetic ions during the sputtering process. The low vapor pressure of tungsten ensures that the sputtering rate remains stable over time, resulting in consistent and uniform film deposition.