Glass Electronic Fiberglass Fabric 7628 E
|
Product Name |
7628 electronic fiberglass fabric |
Style |
fiberglass |
|
Brand |
ZhenAn |
Colour |
white |
|
Weave Type |
Plain Woven |
Place of Product |
China |
|
Yarn Type |
E-glass |
Modes of packing |
Packed with pallet |
|
Size |
Depends on customer request |
After sale service |
3 years |
How it Compares to Other Common Styles
The role of 7628 is best understood by comparing it to other standard fabrics:
|
Property |
Style 7628 |
Style 2116 |
Style 1080 |
|---|---|---|---|
|
Areal Weight |
~200 g/m² (Heavy) |
~105 g/m² (Medium) |
~47 g/m² (Very Light) |
|
Thickness |
~0.190 mm (Thick) |
~0.100 mm (Medium) |
~0.053 mm (Very Thin) |
|
Primary Role |
Build Thickness & Strength |
Versatile All-Rounder |
HDI / Thin Layers |
|
PCB Application |
Server Motherboards, Power Supplies |
Standard Multi-layer Boards |
Smartphones, Wearables |
Primary Applications and Advantages
7628 fabric is used when the primary design goals are mechanical strength, rigidity, and building up board thickness efficiently.
Server and Networking Motherboards: These boards are large and host heavy components (chipsets, connectors, heat sinks). The rigidity provided by 7628 layers is critical to prevent board flexing and warping.
Power Supplies and Inverters: Applications where high voltage and high power are present benefit from the thick insulation and structural integrity of 7628-based laminates.
Automotive ECUs: Engine control units and other under-the-hood electronics require robust boards that can withstand vibration and thermal cycling.
Thick Multilayer Boards: Using a few layers of 7628 allows PCB manufacturers to achieve the desired final board thickness without needing to laminate as many layers, which can improve yield and reduce cost.
Disadvantages and Considerations
Not for High-Speed Signals: While it provides good insulation, its electrical properties (Dk/Df) are not optimized for very high-speed digital or high-frequency RF applications. For these, a style like 2116 or a specialized low-loss material is preferred.
Drilling Challenges: The thick yarn bundles can make drilling very small microvias more challenging compared to thinner fabrics like 106 or 1080.
Resin Wet-Out: Its heavy construction can require careful attention during the impregnation process to ensure resin fully saturates the fabric.
In summary: 7628 E Glass Electronic Fiberglass Fabric is the industry's go-to material for adding strength, rigidity, and thickness to a PCB. It is the foundational building block for large, heavy, and robust circuit boards used in servers, power electronics, and automotive systems.
Our Advantages
Product Support & Export Experience
All our products support third-party inspections.
With 30 years of experience, we have extensive expertise in exporting ferrovanadium and silicon carbide to Europe.
Our considerable stock ensures short delivery times, and we offer flexible payment options, including TT and LC.
MOQ and samples: Negotiable.
